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INTEGRATED CIRCUITS
DATA SHEET
TDA9829T Downconverter for DVB
Product specification File under Integrated Circuits, IC02 1998 Nov 09
Philips Semiconductors
Product specification
Downconverter for DVB
FEATURES * 5 V supply voltage * Gain controlled IF-amplifier * Mixer for DVB-IF downconversion * VCO for Quadrature Amplitude Modulation (QAM) carrier recovery * External VCO control * Internal and external AGC * DVB output level adjust via AGC adjust * High level DVB operational output amplifier * Mute switch for DVB output * Tuner AGC with adjustable takeover point (TOP) * AFC detector without extra reference circuit * Stabilizer circuit for ripple rejection and to achieve constant output signals. QUICK REFERENCE DATA SYMBOL VP IP V3-4(rms) SSB mute I12(sink) CRstps(US) V11(p-p) B-1dB H PSRR Notes 1. Performance may be decreased at VP = 4.5 V. PARAMETER supply voltage supply current input sensitivity (RMS value) VCO phase noise mute attenuation sink current control steepness I14/fIF for USA output voltage (peak-to-peak value) -1 dB bandwidth power supply ripple rejection at pin 11 -1 dB DVB signal at output f = 100 kHz; free-running note 2 maximum tuner gain reduction; see Fig.3 fIF = 43.75 MHz; notes 3 and 4; see Fig.4 CL < 15 pF; RL > 5 k; with internal AGC CL < 15 pF; RL > 5 k see Fig.5 note 1 CONDITIONS MIN. 4.5 81 - 103 - 1.5 0.7 1.8 11 30 26 TYP. 5.0 96 100 107 36 2 0.98 2.1 12 35 36 GENERAL DESCRIPTION
TDA9829T
The TDA9829T is an integrated circuit for DVB-IF processing.
MAX. 5.5 111 150 - - 2.6 1.3 2.4 - - -
UNIT V mA V dBc/Hz dB mA A/kHz V MHz dB dB
suppression of in-band harmonics Vo = 2.0 V (p-p)
2. This parameter is not tested during production and is only given as application information for designing the television receiver. 3. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.4. The AFC-steepness can be changed by the resistors at pin 14. 4. Depending on the ratio C/C0 of the LC resonant circuit of VCO (Q0 > 50; C0 = Cint + Cext; see Table 2).
1998 Nov 09
2
Philips Semiconductors
Product specification
Downconverter for DVB
ORDERING INFORMATION TYPE NUMBER TDA9829T BLOCK DIAGRAM PACKAGE NAME SO20 DESCRIPTION plastic small outline package; 20 leads; body width 7.5 mm
TDA9829T
VERSION SOT163-1
handbook, full pagewidth
tuner AGC TOP TADJ 5 TUNER AGC ViIF1 DVB-IF input DVB ViIF2 IF filter INTERNAL VOLTAGE STABILIZER 19 VP +5 V 17 GND 1 VSID 20 TAGC 12
DVB AGC adjust CAGC CAGC 18 DVB AGC
DVB AGC external
2 x fPC
DVB external VCO control
AGCADJ VAGC 9 8
AFC 14
VCO2 16 VCO TWD
VCO1 15
VVCO 10
AFC DETECTOR
3 4 DVB MIXER
11
VoDVB 2 V (p-p)
LOGIC
TDA9829T
6 2, 7, 13 n.c. AGCSWI MUTESWI
MHB219
Fig.1 Block diagram.
1998 Nov 09
3
Philips Semiconductors
Product specification
Downconverter for DVB
PINNING SYMBOL VSID n.c. ViIF1 ViIF2 TADJ AGCSWI n.c. VAGC AGCADJ VVCO VoDVB TAGC n.c. AFC VCO1 VCO2 GND CAGC VP MUTESWI PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION SIF down input not connected IF differential input signal voltage 1 IF differential input signal voltage 2 tuner AGC takeover adjust (TOP) AGC switch input not connected AGC voltage input AGC adjust input VCO control voltage DVB output tuner AGC output not connected AFC output VCO1 reference circuit VCO2 reference circuit ground AGC capacitor supply voltage (+5 V) mute switch input
AGCSWI 6 n.c. 7 VAGC 8 AGCADJ 9 VVCO 10
MHB220
TDA9829T
handbook, halfpage
VSID 1 n.c. 2 ViIF1 3 ViIF2 4 TADJ 5
20 MUTESWI 19 VP 18 CAGC 17 GND 16 VCO2
TDA9829T
15 VCO1 14 AFC 13 n.c. 12 TAGC 11 VoDVB
Fig.2 Pin configuration.
1998 Nov 09
4
Philips Semiconductors
Product specification
Downconverter for DVB
FUNCTIONAL DESCRIPTION Vision IF amplifier The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration to control the IF gain. VCO, Travelling Wave Divider (TWD) and AFC The VCO operates with a resonance circuit (with L and C in parallel) at double the IF frequency plus symbol frequency. The VCO is controlled by integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to its actual frequency is fed to the capacitors. This control voltage is amplified and converted into a current which represents the AFC output signal. At centre frequency the AFC output current is equal to zero. The oscillator signal is divided-by-two with a TWD which generates a differential output signal for downconverting the IF signal. DVB mixer The gain controlled DVB-IF signal is downconverted to the symbol frequency by use of a four quadrant multiplier. The conversion signal is provided by the VCO and TWD. DVB AGC and tuner AGC The AGC detector charges/discharges the AGC capacitor to the required voltage for setting the IF and tuner gain in order to keep the DVB signal at a constant level.
TDA9829T
A peak detector is used for the DVB AGC. The peak value of (digital) the QAM signal is detected and controlled to a constant value by the variable gain IF amplifier. The detector bandwidth is adapted to the symbol frequency (3 to 11 MHz). The external AGC time constant is given by the IF AGC capacitor at pin 18. The AGC capacitor voltage is transferred to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current (open-collector output). The tuner AGC takeover point can be adjusted. This allows the tuner and the SWIF filter to be matched to achieve the optimum IF input level. The DVB output signal (VoDVB) can be adjusted in a range of 3 dB by a control voltage (Vadj) at pin 9. The internal AGC can be switched off at pin 6 and the IF gain can be controlled by an external voltage at pin 8. The tuner AGC is active in both instances. DVB output amplifier The output amplifier for the DVB signal has a high bandwidth and delivers a 2 V (p-p) signal. The amplifier can be switched to a mute state forced by the signal at pin 20. Internal voltage stabilizer A band gap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Vn tsc(max) V12 Tstg Tamb Ves PARAMETER supply voltage (pin 19) voltage at pins 1 to 10, 13, 14 and 18 to 20 maximum short-circuit time tuner AGC output voltage storage temperature operating ambient temperature electrostatic handling voltage machine model class B CONDITIONS MIN. 0 - 0 -25 -20 -300 MAX. 5.5 VP 10 13.2 +150 +70 +300 UNIT V V s V C C V maximum chip temperature of 125 C 0
1998 Nov 09
5
Philips Semiconductors
Product specification
Downconverter for DVB
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 85
TDA9829T
UNIT K/W
CHARACTERISTICS VP = 5 V; Tamb = 25 C; see Table 1 for input frequencies; input level ViIF(3-4) = 10 mV (RMS value); measurements taken in Fig.8; unless otherwise specified. SYMBOL Supply (pin 19) VP IP V(3-4)(rms) Vi(3-4)(rms) GIF Ri(3-4)(diff) Ci(3-4)(diff) fVCO(max) fVCO(US) fVCO(EU) Vref(rms) SSB VVCO Ri(VCO) CRstps(VCO) supply voltage supply current -1 dB DVB signal at output 1 dB DVB signal at output note 1 4.5 81 - 140 59 fs = 6.9 MHz; 40 dB gain note 2 note 2 - - - 5.0 96 5.5 111 V mA V mV dB dB k pF PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IF amplifier (measured at fIF = 43.75 MHz; pins 3 and 4) input sensitivity (RMS value) maximum input signal level (RMS value) total gain control IF amplifier tilt for f 3 MHz input resistance (differential) input capacitance (differential) 100 200 64 0.5 2.2 1.7 150 - - 1 - - - - - - - VP 76
DVB mixer and VCO (pins 10, 15 and 16); see notes 4 and 5 and Table 1 maximum oscillator frequency VCO frequency for USA VCO frequency for Europe oscillator voltage swing between pins 15 and 16 (RMS value) VCO phase noise VCO control range (pin 10) VCO control input resistance (pin 10) control steepness fs/V10 see Figs 6 and 7 DVB (USA) DVB (Europe) DVB output amplifier (pins 11 and 20) Vo(DVB)(p-p) Ibias(int) Isink(max) Isource(max) DVB output signal (QAM) (peak-to-peak value) DC internal bias current for emitter-follower (pin 11) maximum AC and DC output sink current (pin 11) maximum AC and DC output source current (pin 11) 6 1.8 1.9 1.5 2.0 2.1 2.3 - - 2.4 2.7 - - V mA mA mA - - 0.29 0.40 - - MHz/V MHz/V f = 100 kHz; free-running see Figs 6 and 7 2(fIF + fs) 2(fIF + fs) 2(fIF + fs) 125 - - - 103 0 50 130 97.5 86.0 60 107 - 63 MHz MHz MHz mV dBc/Hz V k
1998 Nov 09
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
SYMBOL mute Vi(mute) IIL tresp
PARAMETER mute attenuation mute switch input voltage (pin 20) LOW-level input current (pin 20) note 2
CONDITIONS - DVB mute; note 3 DVB no mute V20 = 0 V note 6
MIN. 1.3 0 180 - - -
TYP. 36
MAX. - VP 0.8 280 -
UNIT dB V V A
230
DVB AGC detector (pins 8, 9 and 18) response to an increasing amplitude step in the IF input signal response to a decreasing amplitude step in the IF input signal Ich Idch Vi(AGC) Ri(AGC) AGCstps VAGC(ext) Ri(AGC)(ext) charging current (pin 18) discharging current (pin 18) AGC adjust input voltage range (pin 9) AGC adjust input resistance (pin 9) AGC adjust steepness external AGC voltage for DVB (pin 8) external AGC input resistance (pin 8) 2 V < V9 < 3 V see Fig.3 0.25 ms/dB
note 6
-
0.25
-
ms/dB
- - 1 8 - 1 40
200 200 2.5 10 -5 - -
- - 4.5 12 - 4.5 -
A A V k dB/V V k
Tuner AGC (pin 12) Vi(min)(rms) IF input signal voltage for minimum starting point of tuner takeover (RMS value) IF input signal voltage for maximum starting point of tuner takeover (RMS value) permissible output voltage saturation voltage variation of takeover point by temperature sink current input at pins 3 and 4; RTOP = 22 k; ITAGC = 0.4 mA input at pins 3 and 4; RTOP = 0 ; ITAGC = 0.4 mA - 2 5 mV
Vi(max)(rms)
50
100
-
mV
Vo Vsat V TOP ,12 ----------------------T Isink
from external source; note 2 - ITAGC = 1.5 mA ITAGC = 0.4 mA see Fig.3 no tuner gain reduction; VTAGC = 13.2 V maximum tuner gain reduction - 1.5 - -
- - 0.03
13.2 0.2 0.07
V V dB/K
- 2
5 2.6
A mA
1998 Nov 09
7
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
SYMBOL GIF
PARAMETER IF slip by automatic gain control
CONDITIONS tuner gain current from 20 to 80% -
MIN. 6
TYP.
MAX. 8
UNIT dB
AFC circuit (pin 14); see notes 7 and 8 and Fig.4 CRstps(US) CRstps(EU) control steepness I14/fIF for USA control steepness I14/fIF for Europe fIF = 43.75 MHz fIF = 36.15 MHz 0.7 0.45 0.98 0.70 1.3 0.95 A/kHz A/kHz
DVB output signal (IF input to DVB output) Vo(p-p) VO(DC) B-1dB B-3dB C(DVB) H PSRR Notes 1. Performance may be decreased at VP = 4.5 V. 2. This parameter is not tested during production and is only given as application information for designing the television receiver. 3. Mute state also can be achieved by leaving pin 20 open-circuit. 4. Resonance circuit of VCO: Q0 > 50; Cext, Cint and L see Table 2. 5. Temperature coefficient of external LC-circuit is equal to zero. 6. Response speed valid for an IF input level range of 200 V up to 70 mV. 7. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.4. The AFC steepness can be changed by the resistors at pin 14. 8. Depending on the ratio C/C0 of the LC resonant circuit of VCO (Q0 > 50; C0 = Cint + Cext; see Table 2). Table 1 Input frequencies, symbol frequencies and VCO frequencies DESCRIPTION Symbol frequency IF frequency VCO frequency DVB (Europe) 6.9 36.15 86.0 DVB (USA) 5.0 43.75 97.5 UNIT MHz MHz MHz output voltage (pin 11) (peak-to-peak value) DC output voltage -1 dB bandwidth -3 dB bandwidth fundamental input signal and IF harmonics suppression of in-band harmonics power supply ripple rejection at pin 11 Vo = 2.0 V (p-p) see Fig.5 CL < 15 pF; RL > 5 k CL < 15 pF; RL > 5 k; with internal AGC 1.8 - 11 - 35 30 26 2.1 2.5 12 17 40 35 36 2.4 - - - - - - V V MHz MHz dB dB dB
SYMBOL fs fIF fVCO
1998 Nov 09
8
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
handbook, full pagewidth
0.06
70 gain (dB) 60
MHB221
IF input (mV RMS)
Ituner (mA) 50 0
0.6
40
30
(1) (2) (3) (4)
6
20
1
10
60
0 2 -10 1 1.5 2 2.5 3 3.5 4 V18 (V) 4.5
(1) Ituner; RTOP = 22 k. (2) Gain.
(3) Ituner; RTOP = 11 k. (4) Ituner; RTOP = 0 .
Fig.3 Typical IF and tuner AGC characteristic.
handbook, full pagewidth
V14 (V) VP VP = 5 V 22 k 4.5 3.5 2.5 22 k 1.5 0.5
I14 (A) -200 -100 0 100 200 35.75 43.45 36.15 43.75 36.55 44.05
MHB222
(source current)
TDA9829T 14
I14
(sink current)
fIF (MHz)
Fig.4 Measurement conditions and typical AFC characteristic.
1998 Nov 09
9
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
handbook, full pagewidth
MHB223
VP = 5 V VP = 5 V 100 mV (fripple = 70 Hz)
TDA9829T
t
Fig.5 Ripple rejection condition.
MHA661
handbook, full pagewidth
100
fVCO (MHz) 99
98
97.5
97
96
95 0 L1 = 115 nH and C1 = 15 pF. 1 2 3 4 V10 (V) 5
Fig.6 VCO control characteristic for DVB (USA).
1998 Nov 09
10
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
MHA662
handbook, full pagewidth
89
fVCO (MHz)
88
87
86
85
84
83 0 1 2 3 4 V10 (V) 5
L1 = 248 nH and C1 = 5.6 pF.
Fig.7 VCO control characteristic for DVB (Europe).
1998 Nov 09
11
Philips Semiconductors
Product specification
Downconverter for DVB
TEST CIRCUIT
TDA9829T
handbook, full pagewidth
VP = 5 V 22 k (a) no mute (b) mute
(a) (b)
AFC
tuner DVB AGC output
VP = 5 V
100 nF L1 2.2 F 10 nF C1 17 16 15 14
(1)
10 F 22 k 2 V (p-p) BC546 68 220
CAGC
mute switch
DVB output 75
n.c.
20
19
18
13
12
11
TDA9829T
1 2 3 4 5 6 7 n.c.
(a) (b)
8
9
10
n.c. DVB-IF input 51 1 2 3 4
22 k
TOP
AGC switch DVB AGC external VCO control
MHB224
(a) AGC internal (b) AGC external
DVB AGC adjust
(1) See Table 2.
Fig.8 Test circuit.
Table 2
Test circuit values Europe 36.15 MHz 86.0 MHz
alfpage
PARAMETER IF frequency VCO frequency Oscillator circuit
15
(1)
USA 43.75 MHz 97.5 MHz
alfpage
15
(1) (2) (3)
(2)
(3)
16
MHB225
16
MHB225
(1) C(VCO) = 8.2 pF. (2) C1 = 5.6 pF. (3) L1 = 248 nH.
(1) C(VCO) = 8.2 pF. (2) C1 = 15 pF. (3) L1 = 115 nH.
Toko coil Philips ceramic capacitor
5KM 369SNS - 2010Z 2222 632 39478
5KM 369SNS - 1647Z 2222 632 33129
1998 Nov 09
12
Philips Semiconductors
Product specification
Downconverter for DVB
INTERNAL PIN CONFIGURATIONS
TDA9829T
+ handbook, halfpage
handbook, halfpage
5 k
3.6 V
3 1.1 k 5 k 3.6 V
+
1.1 k 1 2.65 V 4
MHB226
+
1.1 k
2.65 V
MHB227
Fig.9 Pin 1; VSID.
Fig.10 Pin 3; ViIF1 and pin 4; ViIF2.
handbook, halfpage
handbook, halfpage
30 k
20 k
26 k
+
9 k 5 1.9 V
MHB228
+
3.6 V
6
3.6 V
MHB229
Fig.11 Pin 5; TADJ.
Fig.12 Pin 6; AGCSWI.
1998 Nov 09
13
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
handbook, halfpage
+
handbook, halfpage
+
12 k 1.6 k
50 k 8 9
10.1 k 3.6 V 17.2 k
MHB231 MHB230
Fig.13 Pin 8; VAGC.
Fig.14 Pin 9; AGCADJ.
handbook, halfpage
+ +
50 k 50 k 11 12.5 k 2.7 V 5 A
MHB232
handbook, halfpage
+
+
5.1 k 10 A
10 VCO
5.1 k 2.7 mA
MHB233
Fig.15 Pin 10; VVCO.
Fig.16 Pin 11; VoDVB.
1998 Nov 09
14
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
handbook, halfpage
handbook, halfpage
+
+
200 A
12
14
2.5 mA
MHB234
1 k
1 k
MHB235
Fig.17 Pin 12; TAGC.
Fig.18 Pin 14; AFC.
handbook, halfpage
+
420
15
handbook, halfpage
GND 17
+
MHB237
16
420 2.8 V
MHB236
Fig.19 Pin 15; VCO1 and pin 16; VCO2.
Fig.20 Pin 17; GND.
1998 Nov 09
15
Philips Semiconductors
Product specification
Downconverter for DVB
TDA9829T
handbook, halfpage
+
+
50 k
18
+
+
handbook, halfpage
19
+
MHB239
200 A
200 A
MHB238
Fig.21 Pin 18; CAGC.
Fig.22 Pin 19; VP.
handbook, halfpage
+
20 13 k 3.6 V
MHB240
Fig.23 Pin 20; MUTESWI.
1998 Nov 09
16
Philips Semiconductors
Product specification
Downconverter for DVB
PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm
TDA9829T
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1998 Nov 09
17
Philips Semiconductors
Product specification
Downconverter for DVB
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TDA9829T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Nov 09
18
Philips Semiconductors
Product specification
Downconverter for DVB
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA9829T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Nov 09
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545104/750/01/pp20
Date of release: 1998 Nov 09
Document order number:
9397 750 04575

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